VCSEL epitaxial chip supplier rumor: new photoelectric has not yet passed Apple product audit.

According to MAMS, industry sources said Taiwan Visual Photonics Epitaxy (VPEC)'s VCSEL (vertical cavity surface emitting laser) epitaxy still needs to wait for the Apple Corp's product review and the VCSEL 3D sensor supply chain of the apple iPhone series and other devices. It will become one of the main business objectives of the company in 2018.
Apple iPhone X VCSEL chip infrared projector in lattice
Source: "apple iPhone X dot matrix infrared projector"
There was a rumor before: "VPEC failed to pass Apple's verification". The news is unfounded market speculation. According to industry sources, the whole audit process of VPEC is still in progress. It is too early to conclude.
Information sources from other supply chains have learned that it will take at least a few weeks for the Apple Corp to complete the review, so the findings will not be announced until April to May.
If VPEC has passed the review, the company is likely to become the second VCSEL extension supplier of Apple Corp, which will be used to manufacture VCSEL components for iPhone, iPad and other devices 3D sensors. At present, the British IQE company is the only supplier of Apple Corp VCSEL epitaxial film.
It is said that as 3D sensors will be widely used in the new iPhone, iPad and other devices launched in the second half of 2018, the Apple Corp will not only be a supplier of VCSEL epitaxy, but the Apple Corp will also seek second VCSEL component suppliers. At present, the Apple Corp's VCSEL components are mainly provided by the Lumentum company in the United States, and the GaAs (GaAs) wafer subunit service is mainly provided by the Win Semiconductor (Win Semiconductor).
From a long-term perspective, 3D sensors are expected to be widely used in mobile devices, automotive electronics and many other fields. As a result, many other Taiwan semiconductor companies, including IntelliEPI, Global Communication Semiconductors (GCS) and Advanced Wireless Semiconductor, are joining the "army" of the 3D sensor led by the semiconductor and VPEC.